Page 4 - 湖北深紫科技有限公司----产品样册

4. 回流焊接 Reflow soldering profile

注意：本产品SMT贴片时需要使用低温锡膏。
Alert: Low temperature solder paste is required for SMT process of this product.

回流焊接是在电路板上组装LED的推荐方法。 DUVTek不保证 Reflow soldering is the recommended method for assembling

通过浸焊方法组装的LED的性能。 LEDs on a circuit board. DUVTek does not guarantee the
推荐的焊接条件（Sn42/Ag1.0/Bi57，SMIC L23-BLT5-T8F） performance of the LEDs assembled by the dip soldering
method.

Recommended soldering conditions (Sn42/Ag1.0/Bi57, SMIC
L23-BLT5-T8F)

5. 防潮封装注意事项 Moisture-Proof Package

在焊接过程中，SMD封装中的湿气可能蒸发并膨胀。 The moisture in the SMD package may vaporize and expand

湿气会损坏深紫外LED的光学特性。 during soldering.

The moisture can damage the optical characteristics of the
DUV-LEDs due to the encapsulation.

6. 储存及使用环境条件 Environmental conditions for storage and use

Item Symbol Unit Value

使用温度 Operating Temperature T OPR ℃ -30 ~ +60

存储温度 Storage Temperature T STG ℃ -30 ~ +100

超出上述最大额定值操作，可能会影响器件的可靠性并造成永 Operating the DUV-LED beyond the listed maximum ratings
久性损坏。 may affect device reliability and cause permanent damage.

DUV-LED不可以反向偏压驱动。 These or any other conditions beyond those indicated under
recommended operating conditions are not implied. The
exposure to the absolute maximum rated conditions may
affect device reliability.

The DUV-LEDs are not designed to be driven in reverse bias.